High Density Interconnects (HDI PCB) are used to meet the market demand for complex designs in smaller form factors across the majority of market segments, (Wireless, Telecom, Military, Medical, Semiconductor, and Instrumentation).
HDI Circuit boards, one of the fastest growing technologies in PCBs, HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter.
They have finer lines and spaces always = <3mil They have a higher circuitry density than traditional circuit boards.
RuoMei maintains years of experience with HDI products and was a pioneer of second generation microvias. now offer an entire family of microvia technology solutions for your next generation products.
HDI boards, one of the fastest growing technologies in PCBs, are now available at Eolane SCM. HDI interconnect board contains blind and/or buried vias and often contains microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards. ...
8 layers , Material: FR4 TG175 ,Board Thickness:0.062\" 0.5OZ base copper , trace and spacing: 3/3 mil , Blind via.min. hole:6mil ,Green soldermask, white silkscreen , impedance control , Hasl lead free , quickturn time:3WDs . Fast turn pcb has over 10 years experience on ...