Stacked CSP
Product Details
|
S-CSP Designation
|
2 Die
|
2 + 1
|
| Package Body Size |
8 x (10, 12, 14) mm
|
15 x 15 mm
|
| I/O Count |
72 (64 + 8)
|
208 (P4)
|
| Ball Pitch |
0.8 mm
|
0.8 mm
|
| Top Die |
2.54 x 7.62 mm
|
3.8 x 7.6 mm
|
| Bottom Die |
5.05 x 6.88 mm
|
7.6 x 7.6 mm
|
| Side Die |
N/A
|
5.1 x 5.1 mm
|
| Package Thickness (max) |
1.4 mm
|
1.4 mm
|
| Substrate |
2 layer
|
2 layer
|
Daisy Chain Availability (mm)
Features
Stacked CSP packages are designed for products requiring increased memory density and performance while reducing package size. Portable electronics products such as cell phones, camcorders and other wireless consumer systems can benefit from the combination of stacked die and small footprint offered by Amkor's Stacked CSP.
Applications
Amkor's Stacked CSP packages leverage existing CABGA manufacturing capabilities and proven package infrastructure while adding the enhancement of placing one die on top of another.
Stacked CSP packages combine the use of thin core substrate material, wafer backgrinding know-how (to 7 mils), and conventional BGA surface mount techniques to offer double the memory capacity for
increased device functionality while allowing manufacturers to maintain size reduction roadmaps. This technology allows for very efficient use of mother-board real estate, reducing size and weight
and supporting the customer's system level cost reduction needs. Stacked CSPs also offer the user the flexibility of combining custom memory with off- the-shelf devices to further reduce total
systems cost.
Descriptions
Amkor's Stacked CSP packages leverage existing CABGA manufacturing capabilities
- L2 Cache:
