1.Detailed Specification of PCB Manufacturing | 1 | Layer | 1-30 layer | | 2 | Material | FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,FR-1,FR-2,Aluminum | | 3 | Board thickness | 0.2mm-7mm | | 4 | Max.finished board side | 500mm*500mm | | 5 | Min.drilled hole size | 0.25mm | | 6 | Min.line width | 0.075mm(3mil) | | 7 | Min.line spaceing | 0.075mm(3mil) | | 8 | Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating | | 9 | Copper thickness | 0.5-4.0oz | | 10 | Solder mask color | green/black/white/red/blue/yellow | | 11 | Inner packing | Vacuum packing,Plastic bag | | 12 | Outer packing | Standard carton packing | | 13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 | | 14 | Certificate | UL,ISO9001,ISO14001,ROHS,CQC | | 15 | Profiling Punching | Routing,V-CUT,Beveling | | 16 | Assembly Service | Providing OEM service to all sorts of printed circuit board assembly | |
