gold PCB Board for electronic products

FPC Production Capabilities

Layers 

1-8layers (soft & hard combined version is 8 layers)

Finished Board Thickness

Min.:10x45mm   Max.:250x1200mm

Available Laminates Material

PI.PET,FR4-PI

Finished Board Thickness tolerance

±0.01mm

Finished hole diameter(Min.)

0.1mm

Finished hole diameter(Max)

0.6mm

NPTH Hole diameter tolerance

±0.025mm

PTH hole diameter tolerance

±0.050mm

Copper foil thickness

12um,18um,35um,70um

Circuit width/spacing(Min.)

≥0.065mm(1/2oz)  ≥0.05mm(1/3oz)

Surface Finished type

OSP.Gold plating,Immersion Gold,Tin plating(lead free)etc.

Gold Flash Ni/Au thickness

Ni:2.54-9um Au:0.025-0.5um

Immersion Tin thickness

0.7-1.2um

Tin plating thickness

3-15um

Drill hole position tolerance

±0.05mm

Punching dimension tolerance

±0.05mm

Certificate

ROHS,UL,ISO9001 etc