Edge chipping of silicon wafers in diamond grinding

Supplier Back Thinning Diamond Grinding Wheel For Silicon Wafer

Silicon wafer back grinding wheels are mainly used for the thinning and fine grinding of the silicon wafer.

Coolant: Oil, emulsion

workpiece processed: silicon wafer of discrete devices, integrated chips (IC) and virgin,ATM, Melchiorre, Peter Wolters, Diskus, Viotto, Wendt

Material of workpiece: monocrystalline silicon and some other semiconductor materials.

Grinders: SHUWA SGM-6301, NTS Nanosurface-180G, NTS Nanosurface 250/NC-VDM

In the middle of the pre-production process, thick silicon wafer can reduce damage; before assembly, silicon wafer is thinned, which is conducive to heat dissipation; reduce package volume; improve mechanical strength (softer after thinning, softer after thinning, minus Small stress); improve electrical performance (short connection); reduce the workload of dicing wafer

Vitrified bond diamond grinding wheel bond agent has higher strength; good wear resistance, sharp cutting Grinding efficiency is high, and easy to trim; generally suitable for silicon wafers, such as rough grinding, semi-finishing grinding, etc.

The diamond grinding wheel has good self-sharpening performance and is not easy to clog; the grinding efficiency is high, the grinding force is small, and the grinding temperature is low The bonding agent itself has good elasticity and polishing performance; the workpiece has high surface finish and good surface quality; it is suitable for fine grinding and polishing of silicon wafers.If you need any products, do not hesitate to contact

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