AIN Aluminum Nitride Material Ceramic PCB Factory Used For Microwave Device

1. Ceramic PCB Board Capabilities:
Layer：1，2
Material：96% Alumina，99% Aluminium nitride(AIN),Sapphire,High Borosilicate Glass
Material Thickness(mm)：0.38，0.5，0.635，1.0
Material Size(mm)：120*120，127*127，132*132，140*130，150*200
Min Hole：0.075mm
Min Line width/space：0.1/0.1mm
Laser Outline: line width：0.1mm，tolerance：+/-0.1mm
Surface Finish:Immersion Silver,Immersion Gold,Immersion Tin,OSP
Copper Thickness(oz):H/H 1/1 2/2 3/3 4/4 5/5 6/6 7/7 8/8 9/9 10/10
Thermal conductivity value: 20~27W/m.K for Alumina; 180W~220W/m.K for Aluminium nitride , 27~30W/m.K for Sapphire,2 ~ 5 W/m.K for High Borosilicate Glass

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