-High bond strength to surfaces -Excellent wet-out and high thermal performance Typical Application Includes -Where need mount heat sink onto BGA graphic/drive processor -LED Lighting Configurations -Sheet form/roll form/die-cut parts Available Thickness -0.1, 0.15, 0.2, 0.25, 0.
Dongguan Leader Optronics Technology Co.,Ltd [2015-12-12 14:47:49 ]