Special futures
· Thickness: 1.6mm
· Application: projector or projecting apparatus
· Minimum trace size: 0.1mm
· Minimum drill: 0.2mm
· With blind and buried holes
· Layers: 1 to 22
· Board finished thicknesses: 0.2 to 7.0mm
· Materials: FR-4, CEM-3, high Tg, halogen-free FR4 and Rogers
· Maximum finished board size: 580 x 900mm
· Minimum hole size: 4mil (0.1mm)
· Minimum trace width/space: 3.5/3.5mil
· Surface finishes/treatments: HASL, lead-free HASL, immersion gold, gold plating, immersion silver, immersion tin and OSP
· Copper thicknesses: 0.5 to 6oz
· Solder mask colors: green, yellow, black, white, red and blue
· Copper thickness in hole: >18um
· Inner packaging: plastic bag (vacuum packing)
· Outline tolerance: ±0.13mm
· Hole size tolerance: (PTH) ±0.076 and (NPTH) ±0.05mm
· With UL and TS16949:2002 marks
· Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
· Profiling: punching, routing, V-cut and beveling
· OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided
Post by sabrina Zhang Electronic Components & Supplies @2012-03-13 17:33:12