Wafer Chipping Detector prevents wafers from being broken in advance by detecting any defects at the ends of semiconductor wafers. A high-resolution camera is used to film
in a line. It detects any defects at the ends of wafer at a high speed.
Reduce photographing time by receiving pictures of the end of wafer in parallel
Increase the speed of processing images by mounting a high-performance CPU in parallel.
Acquire high-quality pictures using VGA class high-resolution color cameras.
Minimize devices and improve their movement by introducing Embedded Systems
Support network ports to monitor and manage devices remotely