HDI board with 3 times pressing and laser drill, PCB used in semiconductor products
Product Details
Most of our boards(PCB) used in telecom, industrial control, computers, aerospace, medical,communication products
PN:J20793M16A
layer count:16
board size:406.4x406.4mm
board thickness:5.08+/-0.50mm
finished treatment:ENIG
min hole:0.15mm blind hole, 0.55mm via hole
min trace width/gap:6/4.5mil
aspect ratio:9:1
distance from hole to trace:9mil
difficult point:
1. semiconductor board, high layer count up to 16,
2. big size up to 406.4x406.4mm,
3. 16 layer HDI board, 3 times pressing, 4 times drilling,
4. 2 times laser drill, layer stack up is so complex,
5. laser drill from L1-L2,L3-L4,L14-L15,L15-L16, mechanical blind hole from L3-L14
16 layer HDI board, 3 times pressing, 2 times drill
high quality PCB with short lead time
- Surface Finishing:ENIG
- Min. Line Spacing:4.5mil
- Min. Line Width:6mil
- Min. Hole Size:0.15mm
- Board Thickness:5.08
- Copper Thickness:1OZ
- Base Material:FR-4
- Model Number:J20793M16A
- Brand Name:JX
- Place of Origin:Guangdong China (Mainland)
- Country:
- telephone:
| Payment Terms: | T/T |
| Min. Line Width: | 6mil |
| Min. Hole Size: | 0.15mm |
| Board Thickness: | 5.08 |
| Copper Thickness: | 1OZ |
| Base Material: | FR-4 |
| Model Number: | J20793M16A |
| Brand Name: | JX |
| Place of Origin: | Guangdong China (Mainland) |
