PCB(Printed Circuit Board), short lead time
PN:J32502M12A
layer count:12
board size:197X120mm
board thickness:2.0mm
finished treatment:HAL+impedance controll
min hole:0.2mm
min trace width/gap:5/4.7mil
aspect ratio:10:1
distance from hole to trace:8mil
difficult point:
1.min hole 0.2mm, aspect ratio:10:1,
2.hole to trace distance only 8mil,
used in MP3/MP4 products
min hole 0.2mm, aspect ratio:10:1
impedance control
PCB(Printed Circuit Board) with short lead time
try circuit board to get through more products
Minimum Order Quantity: | 2 Piece/Pieces |
Payment Terms: | T/T |
Port: | FOB Shen Zhen |
Fob Price: | US$10-100FOB Shen Zhen |
Min. Line Width: | 5mil |
Min. Hole Size: | 0.2mm |
Board Thickness: | 2.0mm |
Copper Thickness: | 1 OZ |
Base Material: | FR-4 |
Model Number: | J32502M12A |
Brand Name: | JX |
Place of Origin: | Guangdong China (Mainland) |
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 8 Layer ENIG Impedance Control Half Hole PCB Own lamination ...
Come From Xinfeng Huihe Circuits Co., Ltd.
Number of layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2.5mil Inner layer W/S: 4.5/4.5mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 6 Layer ENIG Impedance Control PCB Bare Board Own lamination process to ...
Come From Xinfeng Huihe Circuits Co., Ltd.
HDI 3mil control panels PCB in Consumer electronics with impedance control blind and buried holes Application Field: Consumer electronics Layer/Board Thickness: 12L/1.6mm Surface Treatment: ENIG Line/Space: 4/4mil Smallest Hole Diameter:0.15mm Technical Feature: impedance ...
Come From HX Circuit Technology Co.,Ltd.
Application Field: Mobile Layer/Board Thickness:6L/1.6mm Surface Treatment: ENIG+OSP Line/Space: 3.5/3.5mil Smallest Hole Diameter:0.15mm Technical Feature: 1+4+1, impedance control blind and buried holes HX’s capacity ranges from prototype to production volume’s with our ...
Come From HX Circuit Technology Co.,Ltd.
PCB Specifications: Base material: FR4 Layer: 6 layers with impedance control & BGA Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Solder mask & Silkscreen: Green & White Min. line space: 4 mil Min. line width: 4 mil We are pcb factory in Shenzhen China ...
Come From Shenzhen Upride Electronics Co., Ltd
Surface Finishing:ENIG Min. Line Spacing:4mil Min. Line Width:3.9mil Min. Hole Size:0.2mm Board Thickness:3.35mm Copper Thickness:1OZ Base Material:FR-4 Model Number:J28183M12B Brand Name:JX Place of Origin:Guangdong China (Mainland) impedance control min hole 0.20mm min trace ...
Come From Shenzhen Xun Jie Xing Circuit Technology Co., Ltd.