six layers pcb

 

pcb board multilayer pcb rigid pcb
FR-4 1.6mm 190mm*69mm
six layer board plating gold blue

  • Certificates:UL/ISO/ROHS
  • Brand Name:FLYTOP
  • Place of Origin:China
  • Base Material:FR-4
  • Min.Hole Size:0.25
  • Color:blue
  • Min.Line Spacing:0.1
  • Min.Line Width:0.1
  • Board Thickness:1.6mm
  • Surface Finishing:plating gold
  • Base Material:FR-4
  • Brand Name:FLYTOP
  • Place of Origin:Guangdong China (Mainland)
  • Country:China (Mainland)
  • telephone:86-755-26478320
Delivery Time: 10days
Package: vacuum
Supply Ability: 8000 Square Meter per Month
Minimum Order Quantity: 5 Piece/Pieces
Payment Terms: L/C
Color: blue
Min.Line Spacing: 0.1
Min.Line Width: 0.1
Board Thickness: 1.6mm
Surface Finishing: plating gold
Base Material: FR-4
Brand Name: FLYTOP
Place of Origin: Guangdong China (Mainland)
*Your name:
*Your Email:
*To:Shenzhen Flytop Circuit Tech Company Limited
*Subject:
*Message:
Enter between 20 to 3,000 characters. English only.     Characters Remaining: 0 / 3000
*Enter the secure code shown below Mfrbee security Image      Reload Image

We do inquire for you , please wait ...

1.8mm Thickness Immersion Gold 1u Regular 6 Layers PCB

Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...

Come From Shenzhen PEAK Technology Co., Ltd

8 Layer ENIG Impedance Control PCB

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 4/3mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 8 Layer PCB Own lamination process to convenient production for Multilayer PCB ...

Come From Xinfeng Huihe Circuits Co., Ltd.

High Quality Over 10 Layer High Tech HDI PCB Circuit Board Manufacturer

HDI PCB Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm)≥0.075 High Density Interconnector Founded in 2007,PEAK ...

Come From Shenzhen PEAK Technology Co., Ltd

16 Layer ENIG Press Fit Hole PCB

Previous image Next image Number of layers: 16 Surface finish: ENIG Base material: FR4 Thickness: 3.0mm Min. hole diameter:0.35mm size:420×560mm Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Aspect Ratio: 9:1 Special process: via-in-pad Impedance Control Press Fit Hole ...

Come From Xinfeng Huihe Circuits Co., Ltd.

10 Layer Impedance Control Resin Plugging PCB

Previous image Next image Number of layers: 10 Surface finish: ENIG Aspect Ratio: 8:1 Base material: FR4 Outer Layer W/S: 4/4mil Inner layer W/S: 5/3.5mil Thickness: 2.0mm Min. hole diameter:0.25mm Special process: Impedance Control, Resin Plugging, Different Copper Thickness ...

Come From Xinfeng Huihe Circuits Co., Ltd.

8 Layer ENIG Half Hole Custom PCB

Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3mil Inner layer W/S: 5/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: half hole Advantages Of 8 Layer ENIG Half Hole Custom Made PCB Own lamination process to convenient production ...

Come From Xinfeng Huihe Circuits Co., Ltd.

4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/4mil Inner layer W: 21mil Thickness: 0.4mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole PCB Electric Circuit Board Own ...

Come From Xinfeng Huihe Circuits Co., Ltd.

4 Layer ENIG Impedance Control Half Hole Fr4 PCB

Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...

Come From Xinfeng Huihe Circuits Co., Ltd.

2 Layer OSP Impedance Control Half Hole PCB

Number of layers: 2 Surface finish: OSP Base material: FR4 Outer Layer W/S: 6/4mil Thickness: 1.0mm Min. hole diameter: 0.25mm Special process: impedance control+half hole Advantages Of 2 Layer OSP Impedance Control Half Hole PCB Own lamination process to convenient production ...

Come From Xinfeng Huihe Circuits Co., Ltd.

2 Layer ENIG Impedance Control Half Hole PCB

Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient ...

Come From Xinfeng Huihe Circuits Co., Ltd.