Multilayer PCB

Technical SpecificationMinimum line width: 3. 5milMinimum line Spacing: 4milMinimum hole size: 0. 15mmMinimum Annular Ring: 5milMax Copper thickness: 5OZMax production size: 600X800mmBoard Thickness: Double Sides 0. 2-3. 0mm, Multilayers: 0. 40-6. 0 mmMin Solder Mask Bridge 0. 08mmPlugging Vias Capability: 0. 2-0. 8mmTolerance: Plated holes Tolerance: 3milNon-plated hole tolerance 2milOutline Tolerance: 0. 1mmFunctional test: Insulating resistance: 50 ohms (normality) Peel off strength: 1. 4n / mmThermal Stress test: 288, 10 secondsSolder mask hardness: 6HE-Test voltage: 10V-250VWarp and Twist: 0. 7%