Major material: Fr-4, cem-1, cem-3Board thickness:0.6-3.2mmSurface finishing: Gold plating, immersion goldHot-air solder leveling(hal)Solder mask: Wet flimCopper thickness(finishing):0.5oz to 3ozMin hole size:0.3mmMin line width and spacing:6 milProfile: V-cut
Major material: Fr-4, cem-1, cem-3
Board thickness:0.6-3.2mm
Surface finishing: Gold plating, imme
| Payment Terms: | T/T |
| Port: | NINGBO |
| Certification: | UL(E231017) |
| Model Number: | JT002 |
| Brand Name: | Hi-Circuit |
| Place of Origin: | Wenzhou |