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PCB Manufacturing Capability
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Layers Count :
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1 ~ 28 Layers
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Material :
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FR-1 / FR-2 / CEM-1/ CEM-3 / FR-4 / FR-5
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Aluminum
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High Tg and Heavy Copper serial
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RoHS
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Max. Copper Weight :
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10 oz.
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Max. Board szie :
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21" X 24"
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Max. Board Thickness :
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0.2"
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Min. Finished Holes Size :
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0.008" for 2 Layers.
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0.016" for 4 Layers.
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0.020" for 6 Layers.
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0.028" for 8 Layers.
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Min. Finished Holes Size :
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0.010" for Drilling Machine
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0.004" for Laser Drilling Machine
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Aspect Ratio :
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16 : 1
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Min. Trace Width / Spacing :
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4/4 mil
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SMT / BGA Pitch :
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0.010" for SMT Pads , 0.020" for BGA Pads.
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Surface Treatment :
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HAL
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Immersion Gold / Silver
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TIN
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Gold Plating
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ENTEK106A
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Carbon
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Peelable Mask
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Controlled Impedance :
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+/-5%
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Blind / Buriedf Via :
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Enable
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