PCB
Product Details
14 layers
bonded with flexible bond plies; controlled
depth laser vias on the outer three layers of
each side.
Application: Infrared Camera
Size: 6.6 by 1.6
Layers: 14 overall, pure flex
Materials: Adhesiveless flex
Adhesive bond plies and coverlay
Traces: 4/4 innerlayers
4/4 outerlayers
Minimum hole: .006
Minimum pad: .012
Thickness: .060
Other: Controlled depth laser vias
3/8/3 construction
5 Lamination cycles
Silver epoxy shielding
