Tin
Surface treatment: Hard gold/ ENIG /HASL / Carbon Ink/OSP(ENTEK CU 106AX)/ Immersion
Impedance:+/-10%
Warpage:0.5%
Solder Mask Bridge between Solder Dam 3mil(0.07mm)
Micro Via:4mil(0.1mm)
Hole to Hole Tolerance:+/-3mil(0.08mm)
Minimum Via Size:8mil(0.2mm)
Via/Drill Size:Minimum Drill Hole Diameter 8mil(0.25mm)
Lyaer to Layer Registration:+/-5mil(0.13mm)
Maximum Thickness(10layers):200mil(5.0mm)
Minimum Thickness(8Lyesrs):24mil(0.6mm)
Minimum Thickness(6Layers):16mil(0.4mm)
Minimum Thickness(4layers):12ml(0.3mm)
Minimum Thickness(2layers):4mil(0.1mm)
Layer Count & Thickness:1-16layers
Minimum Line Spacing (External):4mil(0.1mm) for mass production and 3mils for samples.
Minimum Line Width(External):4mil(0.1mm) for mass production and 3mils for samples.
Minimum Line width( Internal)4mil(0.1mm) for mass production and 3mil for samples
Line Width & Spacing:
Maximum Panel size:39*23 (1000mm*600mm)
Material used: FR4. High Minimum 170, Hifrequency, Metal based: Alumininium ect.
Fast and Cheap pcb board(carbon key pcb board):
Fast and Cheap pcb board(carbon key pcb board):
38 carbon key;
PTH and NPTH holes
| Delivery Time: | 3days-10days |
| Package: | Vaccum package. |
| Supply Ability: | 20000 Square Meter per Month |
| Minimum Order Quantity: | 1 Piece/Pieces |
| Payment Terms: | L/C,T/T,Cheque |
| Port: | HK |
| Min. Line Width: | 6mil |
| Min. Hole Size: | 0.56mm |
| Board Thickness: | 1.6mm |
| Copper Thickness: | 1oz |
| Base Material: | FR4 |
| Model Number: | Carbon-key |
| Brand Name: | Vitek |
| Place of Origin: | Guangdong China (Mainland) |