Flip Chip

Assembly Packaging - C4 Flip Chip (08)C4 Flip Chip (controlled Collapse Chip Connection):- Eutectic, lead free and high lead solder bumps are available.- Underfill available.

  • Country:Taiwan
  • telephone:886-886-2-2679-0122
Assembly Packaging - C4 Flip Chip

Tong Hsing Electronic Industries, Ltd.

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