Gold bumping Roadmap
Product Details
| Process capability | 2007 | 2008 | Gold Bump Roadmap | |||||||
| Item | Current | Q1 | Q2 | Q3 | Q4 | Q1 | Q2 | Q3 | Q4 | |
| Bump Pitch (um) | 27 | 18 | 18 | 16 | 16 | 16 | 16 | 14 | 14 | |
| Bump Space (um) | 11 | 8 | 8 | 6 | 6 | 6 | 6 | 6 | 6 | |
| Bump Width (um) | 16 | 10 | 10 | 10 | 10 | 10 | 10 | 8 | 8 | |
| Bump Height within Chip (um) | <2.0 | <1.5 | <1.5 | <1.5 | <1.5 | <1.2 | <1.2 | <1.2 | <1.2 | |
| Bump Height within Wafer (um) | <4.0 | <3.0 | <3.0 | <3.0 | <3.0 | <2.5 | <2.5 | <2.5 | <2.5 | |
| Bump Height within lot (um) |
- Country:Taiwan
- telephone:886-886-7-8210088
|
Item Current Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Bump Pitch (um) 27 18 18 16 16 16 16 14 14 Bump Space (um) 11 8 8 6 6 6 6 6 6 |
