semiconductor test service

Memory Test ITEST is proceeding with Probe & Final Test of the various kindsof Memory Device such as SRAM, FLASH Memory, DRAM, PSEUDO SRAM, Embedded Memory and Mask ROM etc, and keeping the capacity capable to test various kinds of Package Type such as TSOP, FBGA, UBGA, SOP, PLCC and QFP etc. Together with this, the best Engineering Capacity in the world supports all kinds (Probe Card, Socket, Change over Kit, Hi-Fix Board) of development including program development that is necessary to Wafer Probe & Final Test from the goods Designby your company.