Flip Chip

Country: Taiwan
telephone: 886-886-2-2679-0122

Assembly Packaging - GGI Flip Chip (09)GGI Flip Chip (Gold Gold interconnections):- Maximum die size: 5mm x 5mm- Maximum number of bumps: 20- Minimum bump pitch: 150 micons- Major applications in power LED, SAW, TCXO and MEMS.