COG (Chip On Glass)

COG module is a precise technology bonding bare chip IC and ITO glass together.The most amazing point is, by using COG technology, it is no need to use PCB (printed circuit board). Instead, we can put the circuit directly on the LCD panel. As the weight of COG module is only at one-third (1/3) compare to conventional type of design, COG technology can easily fulfill the requirement on small and less weight product such as handheld communication device.
ACF (Anisotropic Conductive Film) is a thermoset epoxy system that includes conductive particles uniformly distributed in a non-conductive adhesive film. ACF is well suited for flip chip assembly in very fine pitch chip-on-board (COB), chip-on-flex (COF), or chip-on-glass (COG) applications. It is used commercially for millions of units of COG modules.In ACF assembly, heat and pressure are applied to trap the conductive particles between the substrate pads and the IC bumps, forming permanent electrical connections as the epoxy film cures.