WLCSP (Wafer Level Chip Scale Package)

WLCSP is a acronym of Wafer Level Chip Scale Package
Wafer-level chip scale packaging has advantages such as miniaturizing, thinning and lightening packaged chips, also realizing low manufacturing cost of packaging. The process of applying a redistribution layer to the wafer, and solder bumps directly to the redistributed wafer.
Applied in memory, micro-processors/controllers, analog, Flash, SRAM, DRAM, ASICs and DSPs, ASICs, RF devices