FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94 V-O
Glass passivated junction
500W Peak Pulse Power
capability on 10/1000
Plastic package has Underwriters Laboratory Flammability Classification 94 V-O |
FEATURES For surface mounted applications in order to optimize board space Glass passivated junction Built-in strain relief Excellent clamping capability Low profile package Low inductance Excellent clamping capability Fast response time: typically less than 1.0 ps from 0 volts ...
Come From Micro Device Electronics, Inc
FEATURES Plastic package has Underwriters Laboratory Flammability Classification 94 V-O Glass passivated chip junction in DO-41 package 400W surge capability at 1ms Excellent clamping capability Low zener impedance Low incremental surge resistance Excellent clamping capability ...
Come From Micro Device Electronics, Inc
package has Underwriters Laboratory Flammability Classification 94 V-O Glass passivated chip junction in DO-15 (DO-204AC) package 600W surge capability at 10/1000 ...
Come From Micro Device Electronics, Inc
surface mounted applications in order to optimize board space Glass passivated junction Built-in strain relief Excellent clamping capability Low profile package Low inductance Excellent clamping capability Fast response time: typically less than 1.0 ps from 0 volts to BV min ...
Come From Micro Device Electronics, Inc
FEATURES For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Repetition rate (duty cycle):0.01% Fast response time: typically less than 1.0 ps from 0 ...
Come From Micro Device Electronics, Inc
FEATURES Plastic package has Underwriters Laboratory Flammability Classification 94 V-O Glass passivated chip junction in Molded Plastic package 1500W surge capability at 1ms Excellent clamping capability Low zener inpedance Fast response time: typically less than 1.0 ps from 0 ...
Come From Micro Device Electronics, Inc
FEATURES optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Repetition Rate(duty cycle):0.05% Volts to BV min. Typical IR less than 1mA above 10V High temperature soldering: ...
Come From Micro Device Electronics, Inc
FEATURES For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Repetition Rate(duty cycle):0.05% Volts to BV min. Typical IR less than 1mA above 10V ...
Come From Micro Device Electronics, Inc
FEATURES Plastic package has Underwriters Laboratory Flammability Classification 94 V-O Glass passivated junction 3000W Peak Pulse Power capability on 10/1000 ...
Come From Micro Device Electronics, Inc