SCHOTTKY BARRIER DIODE (CHIP&DEVICE) SBDP40 (chip appearance)

chip size (mm²/mil²)	chip thickness (?m)	bonding pad dimension (mil²)	scribe line width (?m)	top metal	back metal	passivation	wafer size (inch)	Electrical characteristics (Ta=25degC) Forward voltage (Vf)(V)
0.35

SBDP40 (chip appearance)

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