Catalog No. QOH Order LMA-1150-Z-SP3.01.750"DIA 1.100"OALLENS ASSEMBLY MOUNTED 5.00"FLMore Details 1 Register for Pricing LMA-1150-Z-HP4.0-REINSTALLEDREPLACED LENS / SEALLENS ASSEMBLY MOUNTED 5.00"FLMore Details 2 Register for Pricing LMA-1550-Z-HP8.0-REINSTALLEDREPLACED LENS / SEALLENS ASSEMBLY MOUNTED 5.00"FLMore Details 1 Register for Pricing Navigation: [1]
LMA-1150-Z-SP3.0 1.750DIA 1.100OAL LENS ASSEMBLY MOUNTED 5.00"FL |
wholesale lens wipes lens wipes bulk The cleaning of glasses lenses, mobile phone screens, and camera lenses requires professional lens wipes to clean, otherwise, the screen\'s coating may be damaged. The function of the coating is to improve the light transmittance and reduce ...
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To assemble the bracket part of the ZJ slurry pump, first remove the dirt in the bracket cover and bracket body oil pool, and wipe the bearing holes clean. (1) After cleaning the joint surface of the bracket body and the bracket cover, determine the thickness of the added paper ...
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Ulirvision offers a wide range of range of infrared lens for infrared thermal imaging camera. Below are our featured thermal infrared lens and key factors need to consider for choosing ir camera lens. Thermal Infrared Lens Manual Lens Focal Length (mm)F NumberAdapter ...
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Sepcification of Athermalized Lens Focal Length (mm) F Number Adapter Detector Field of View Rear Working Distance (mm) Interface Physical Dimension Working Temperature Coating Waterproof Rating Coating Athermalized Lens 9 1 640*480-17μm 72.8°*53.4° 4 M25*0.5 L32 ψ33 ...
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GreensTone specializes in contract manufacturing of printed circuit board assemblies (PCBAs), subsystem integration and full-box builds. VALUE-ADDED ELECTRONICS MANUFACTURING SERVICES We offer value-added services from early-stage engineering support to manufacturing testing, ...
China box build assembly services, known as systems integration, can be anything from a simple printed circuit board assembly housed in a small enclosure, to a cabinet housing a complex electromechanical system. Box build pcb involves everything including design, production and ...
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. ...
100+ Various materials are available. Support parts assembly service. As part of our machining and fabrication services, Xin Pin offers part and assembly prototyping. How will a final product look? Will it work properly? How can it best be explained to a client? Xin Pin will ...
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