BGA reballing stencil

0.76*0.76mm universal template
0.6mm universal template
0.5mm universal template
82801GB/82801GBM
82801HB/82801HBM
82801FB/82801FBM
82801EB/82801EBM
82801DB/82801DBM
845MP/855PM
915PM/915GM
945 northbridge
945GM/945PM
965 northbridge
FGO5200
ATI9200/ATI9600
ATI7500/ATI9000
Spec: 79MM*79MM, length between holes:68MM
 


We provide all kind of bga tempaltes....

BGA chip ball arrangement template NH82801HBM
Ball 0.6
condition : NEW 
Spec: 79.6*79.6mm or 99*99mm

provide all kinds of BGA stencil

  • Place of Origin:China (Mainland)
  • Country:China (Mainland)
  • telephone:86-755-83018404
Payment Terms: T/T,Western Union,Paypal
Place of Origin: China (Mainland)
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100% Original Ametech BGA solder flux paste for BGA Reballing no-wash

Imported from America flux 559,pure color ,no variedness,smell wonderful,no bad smell,no need to wash, the color residue is light,with very high SIR value,apply to add the balls on bga chipsImported from America flux 559,pure color ,no variedness,smell wonderful,no bad smell,no ...

Come From Shenzhen Shuttle Star Industrial Co.,Ltd

High quality bga reballing heater soldering station with digital display

Made of quality heating material, temperature and time digitally displayed, controlling temperature stably.With heat resistant glass cover, easy to inspect BGA soldering condition, eliminated environmental interference.Aluminum alloy board, heating from the bottom, stable, with ...

Come From Shenzhen Shuttle Star Industrial Co.,Ltd

BGA221 Reball Kit_11.5X13mm, eMCP Reballing,BGA221 reballing Kit

Aluminum alloy structure, lightweight and durable structure Precision IC guide, accurate positioning. Steel Dimensions: (80 x 80) mm, apply to BGA221, size: 11.5x13mm The unique tin ball storage room design, no need to poure out excess solder ball every time, make production ...

Come From ShenZhen Sireda Technology Co.,Limited

BGA169(eMMC) Reball Kit_14X18mm,NAND flash repair ,Reballing Kit

Aluminum alloy structure, lightweight and durable structure Precision IC guide, accurate positioning. Steel Dimensions: (80 x 80) mm, apply to BGA169, size: 14X18mm The unique tin ball storage room design, no need to poure out excess solder ball every time, make production more ...

Come From ShenZhen Sireda Technology Co.,Limited

BGA Stencil FOR XBox360 CPU

BGA Stencil FOR XBox360 CPU ...

Come From Speed Laptop Parts (HK) Ltd.

BGA Stencil for xbox360 southbridge

BGA Stencil for xbox360 southbridge is available from us. ...

Come From Speed Laptop Parts (HK) Ltd.