DVS-355Z Rugged Vehicle/Embedded Platform with Intel Core Duo Mobile Processor

Main Features
  • Fanless design within sealed construction
  • Support Intel? Core Duo Mobile Processor
  • Rugged enclosure and easy mounting design for diversified integration needs
  • Anti-vibration, anti-shock design to ensure maximum reliability
  • Wide power source (9-30V DC)
  • CardBus interface for optional mobile communication module
  • All in one main board design

Rugged Vehicle/Embedded Platform with Intel Core Duo Mobile Processor

  • Country:Taiwan
  • telephone:886-02-29580058
Delivery Time: 2 weeks for FOB.
Supply Ability: 1000 Set/Sets per Month
Minimum Order Quantity: 1 Set/Sets
Payment Terms: T/T,Western Union
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