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SPUTTERING TARGET BONDING Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded ...
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Sputtering target bonding is a process that involves attaching a sputtering target to a backing plate or a substrate holder. The bonding process is crucial in ensuring smooth and efficient sputtering operations. The target material is typically bonded to a metallic or ceramic ...
Metal sputtering targets are critical components of the sputtering process used in the manufacturing of thin films for semiconductor and other advanced applications. These targets are high-purity metals or alloys with specific chemical compositions, and they are subjected to ...