Flip Chip on Leadframe (FCOL) Packaging Methods service
Product Details
APS has developed a proprietary FCOL assembly technology using Pillar Bump that seriously challenges the cost of conventional wire bond process while reaping the full benefits of flip chip.A
comparison among the Wirebond, High-Lead Bump and APS Pillar Bump flip chip process is shown below.
APS has developed a proprietary FCOL assembly technology using Pillar Bump
- Country:Singapore
- telephone:65-65 6482 5885
| APS has developed a proprietary FCOL assembly technology using Pillar Bump |
