Ni Plated Film

JeonYoung Plates 0.1~2?m thickness Ni on one or two sides of Cu foils (roll pressed or electroplated) having 18~70?m thickness and both sides of the above films are characterized to show different morphology.In detail, matt side was subjected to nodular treatment in order to maximize the bonding power to polymers (PE, PI and PET), while the opposite side maintained shiny state for the appearance of final products. Substrate foil used for Ni plating in Jeonyoung ECP Substrate Plating specification Properties Usage Copper Thickness: 0.1~30?m Copper Alloy Nodule Rz: 8~15?m Reinforcement Electronic material STS/Steel General Plating Rz: 0.5~10?m Hardness PTC Aluminum Width: 10~350mm Conductivity Protection circuit Zinc Length: 100~2000m Optical property Cellular phone Properties of nickelElementSpecific Specificgravity(g/ ) Meltingpoint(

Substrate foil used for Ni plating in Jeonyoung ECP

Material:PE

Country:Taiwan
telephone:886-886- 2- 22047861


Material:	PE

plated film

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