THICK FILM
Product Details
Thick Film metalization is used to construct electrical circuits onto ceramic or metal substrates for automotive electronics, microelectronics packaging, resistive heaters, and passive circuit
applications. In the process, a series of metal traces and up to 35 dielectric layers are created on the substrate using sintering and drying processes.
Thick Film metalization is used to construct electrical circuits onto ceramic or metal substrates
- Country:Singapore
- telephone:65-1 978 667 4111
| Thick Film metalization is used to construct electrical circuits onto ceramic or metal substrates |
