MY500 printer

Key benefitsStencil free Improved process control Enables higher density of components on PCB's Virtually eliminates changeover and lead times Designed for fast changeovers and maximum uptime Complete off-line preparation Using a revolutionary new technology for solder paste application, the MY500 shoots solder paste on the fly without touching the PCB. Because it needs no stencils, it offers many advantages over the standard screen printer like more PCB design freedom and virtually no changeover or lead times. Solder paste deposits can be adjusted on-the-spot in three dimensions.