June Chip 300 Die Bonding machine
Product Details
Die Bonding
Univeral Applications for Digital, Matrix, Super Flux LED, SMD LED, Chip @LED,lamp etc.
Average Cycle Time: 300ms / cycle
UPH:12K
Wafer X/Y :6"*6"
Workholder X/Y :10"*6"
Die Placement Accuracy:+ - 0.5mil
Die Size:5mil-40mil
Wafer Diameter: 6"
Maximum 4 wafers working at the same time
Flexible and Changeable Collet Head
Automatic Inspection System, Automatic Level Detection
Intelligent PR System (iPR)
LCD touch screen
Bilingual Menu
Power 2000W
Dimension 1200 x 900x 1500mm
Weight 450kgs
Die Bonding the best wire bonding technology in China. Occuipeid 35% market share in China
- Certification:ISO9001
- Type:General
- Automatic Grade:Automatic
- Model Number:June Chip
- Brand Name:JAL
- Place of Origin:Finland
- Country:China (Mainland)
- telephone:86-755-86238792
| Supply Ability: | 50 Piece/Pieces per Month |
| Minimum Order Quantity: | 1 Piece/Pieces |
| Port: | shenzhen |
| FOB Price: | US $28,000 - 30,000 |
| Certification: | ISO9001 |
| Type: | General |
| Automatic Grade: | Automatic |
| Model Number: | June Chip |
| Brand Name: | JAL |
| Place of Origin: | Finland |
