MS-3 SERIES scrubber

This equipment removes the wafers particle and minute dust by cleaning and drying 8" & 12" wafer through using a brush, ultrasonic waves, high pressure, chemical and pure N2. - Mass- product unit extensible for multi-process - Different recipe setting and aggregate process per wafer - High Throughput - Compact design - Suitable for MEMS and BUMP Process - Various functions of main S/W using Windows XP - G.U.I. Environment? X\ easy Operation - Process management support by powerful D/B buildup - Process management support by powerful D/B buildup D/B download using USB (Microsoft, Excel) Recipe Up/Download using USB (Microsoft, Excel) - Host on-Line response(SECS-II, GEM) - Internal cleaning management through FFU and FOUP opener installation