Auto Mold
Product Details
Dimension : 1900mm(W), 2000mm(H), 4000mm(L) Clamping Force : MAX. 120 Ton / Chase ( Press ) Air Flower Rate : MAX. 3,000 L/min Compressed Air : MIN. 5.0 Kgf/cm2 Power Consumption : MAX. 40Kw ( 125A ) AVG. 15Kw Productivity : 260 SPH Operating Control : Controller : PLC Monitoring : Above Pentium PC-2GHz Console : In touch ( Windows version ) Onloading / Offloading : MAX. 6 Magazines
Dimension : 1900mm(W), 2000mm(H), 4000mm(L)
Clamping Force : MAX. 120 Ton / Chase ( Press )
- Model Number:Semiconductor Packaging Machine
- Brand Name:Semisys
- Place of Origin:South Korea
- Country:South Korea
- telephone:82-31-2392931
| Payment Terms: | L/C |
| Model Number: | Semiconductor Packaging Machine |
| Brand Name: | Semisys |
| Place of Origin: | South Korea |
