semiconductor package mould(semiconductor package die)
Product Details
high precision metal stamping die
semiconductor encapsulation
semiconductor encapsulated mould,
semiconductor package mould,
semiconductor package mould, semiconductor package die
- Product Material:Metal
- Shaping Mode:Punching Mold
- Brand Name:Zhida
- Place of Origin:Guangdong China (Mainland)
- Country:China (Mainland)
- telephone:86-20-82212288
| Product Material: | Metal |
| Shaping Mode: | Punching Mold |
| Brand Name: | Zhida |
| Place of Origin: | Guangdong China (Mainland) |
