Gasket

Application: Bumping process (electroplating)- Gasket for 8 wafer: Compound V6017- Gasket for 12 wafer: Compound TV6004- Excellent chemical resistance- Perfect sealing application for bomping process

  • Country:Taiwan
  • telephone:886-886-2-22988670
High chemical resistancePerfect sealing application for the process

MFC Sealing Technology Co., Ltd.

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