1. Home
  2. General Industrial Equipment
  3. Laser Equipment

Die Bonders

Product Details

Manual Die Bonder is designed for attachment of semiconductor chips by vibration eutectic bonding and epoxy bonding

  • Model Number:EM-4075A

Planar Concern

  • Country:Belarus
  • telephone:375-17-2232226
Model Number: EM-4075A

Send inquiry / quota request to Die Bonders

Planar Concern

Enter 20 to 3,000 English characters. Characters: 0 / 3000

Security code Reload image

Submitting We are sending your inquiry, please wait...

Social Connect

  • mfrbee.com social network on weibo.com
  • mfrbee.com social network on twitter
  • mfrbee.com medium business blog

Browse by Category

Contact Us

  • contact mfrbee.com by email