Wire Bonders

EM-4340A1 Wire Bonder is intended for bonding aluminum wires to die pads and package leads by ultrasonic wedge bonding method.
The bonding head, rotating by f and movable by X, Y, Z axes, ensures the possibility to assemble power transistors in discrete packages and on tape strips as well.
The bonder allows bonding following the die-package and package-die scheme.
The value of wire cut is programmed, what allows cutting wire on a die without contact of the blade with the die.
Programmable form of ultrasonic generator bonding pulse and load pulse provide reliability and quality of bonds.

EM-4340-A1 is designed for automatic ultrasonic bonding of aluminium wires of increased diameter to pads of power transistors