HL 101 P laser machine

The laser device has the best beam quality for processing of the smallest holes and cutting kerfs, and also high pulse rates for machining large workpiece thicknesses. Focal diameter and position of the workpiece are independent of programmed laser output and pulsed sequence. This guarantees constant machining quality.
 

  • Country:India
  • telephone:91-1 8602556000
The laser device has the best beam quality for processing of the smallest holes and cutting kerfs

TRUMPF Inc.

Enter 20 to 3,000 English characters. Characters: 0 / 3000

Submitting We are sending your inquiry, please wait...