Laser Cutting Machine

Outstandingly high efficiency
Fairly narrow kerf width
Well suited for cutting thick ultra-hard materials, like PDC for drill bits

High quality
High efficiency
Typically recommended to cut cutting tool blanks

Good quality
Medium efficiency

Remarks

Cutting, Drilling, Engraving

Cutting, Drilling, Engraving

Cutting, Drilling, Engraving

Applications

120mm/min

60mm/min

30mm/min

Speed Recommended in cutting 1mm thick PCD

0.10-0.20mm

0.05-0.15mm

0.05-0.15mm

Kerf Width

6mm

5mm

3.5mm

Ceramics, Silicon Wafer

6mm

4mm

3.2mm

Cemented Carbide

6mm

4mm

3.2mm

Solid PCBN Inserts

6mm

3.5mm

2.5mm

PCD and PCBN backed with cemented tungsten carbide

6mm

3mm

2mm

Solid PCD Inserts

Depth of Cut

80-100W

40-50W

20-25W

Power

LCP80

LCP40

LCP20

Machine Type

Introduction to XBR-LCP

The introduction of LCM is exceedingly significant for high precision cutting of super-hard materials as well as drilling of diamond. It is especially important that, in the drilling of wire dies, LCM can not merely reach outstanding surface finish, it is also competent in high speed drilling and large diameter drilling that are beyond the capabilities of conventional laser drilling machines. It displays far superior performances to any type of laser system in the market.

LCM is a newly developed nanosecond giant impulse laser cutting machine, and it very well combines the advantages of both LCP and LCQ. LCM is not merely good at high efficiency cutting of super-hard materials with maximal thickness 4.0 millimeters, its thermal damage is also far lower than LCP. Those problems that mono diamond, CVD diamond and low CBN content PCBN are prone to damage when laser-cut by LCP and that LCQ performs low cutting efficiency are very well solved by this product.

(Nanosecond pulse)

LCM

LCQ is mainly applied in the high precision machining and micro-machining of various ultra-hard materials. Its depth of cut and efficiency is far lower than that of LCP, yet it causes far less thermal damage, and it is highly competitive for high precision machining. LCQ performs advantageous efficiency in drilling and grooving, and it also allows an extraordinary range of applications that can not be finished by LCP.

(Q - CW laser)

LCQ

LCP is ideally suited for the fast cutting of thick materials. It has the advantages of high efficiency, narrower kerf width and less thermal damage when compared with the same products from other companies Its single side depth of cut can reach 6mm, while its double side slicing depth is as much as 10mm. LCP also enables super-hard materials within 2mm thick to be cut at a rate of 60mm/min and above, whereas its laser path could be controlled within 0.1mm. It presently is the mainstream product for the cutting of PCD, PCBN, CVDD, super-hard ceramics, etc.

(Microsecond Pulse)

LCP

Characteristics

Type

Classifications of Laser Cutting Machines

With over 7 years hands-on expertise in the area of super-hard materials, Supower has been constantly improving the quality of work for all those who use laser technology for industrial applications.

Supower state-of-the-art laser cutting machines are available in semi-automatic or fully automatic versions. These high-precision cutting systems perform fast and accurate cutting, drilling and engraving Various materials, including PCD, PCBN, CVD diamond, mono diamond, tungsten carbide, ceramics and silicon wafers, have been among its most successful applications.

Beijing Supower Company is the Chinese leader in the production of laser systems, develops constantly updated laser machines using its own technology and multidisciplinary know-how.

laser cutting machine

laser cutting machine mainly suit cutting,drilling,engraving PCD,PCBN,CVD, monodiamond,tungsten carbide,cearmics , slilicon wafe