Mechanical Socket Body: Peek Ceramic Socket Lid: AL,Cu,POM Contact: Spring Probe Solder Ball: RoHS Compliant(Lead-free) 96.5Sn/3.0Ag/0.5Cu(SAC305) Operation Temperature: -40ºC to 140ºC Life Span at Operating Travel:100K cycles Min. Cycles Spring Force: 20g ~ 30g per Pin
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Electrical Current Rating (Continuous) : 1A Min. DC Resistance: 100mohm Max.
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The F solution designed for test, debug, and validation of devices of BGA, LGA, QFP, QFN, SOP, etc. For devices with more than 256 pins, please look for our “U” solution. Test, debug, validation of devices of BGA,LGA,QFP,QFN,SOP,etc Pitch from 0.4mm to 1.27mm "Buy and use" ...