Number of layer: 1-56L Base material: CEM-3, FR4, High TG FR4, Aluminum, Rogers, Arlon, etc. Copper weight: 0.5OZ-6OZ(18mil-210mil) Board thickness: 0.2-7.2mm(8mil-282mil) Board types: Rigid, Flexible, Rigid-flex, Buried & Blind via board, HDI, etc. Silk screen: White, blue, ...
PCB Specifications: Base material: FR4 Layer: 6 layers with impedance control Board thickness: 1.6 mm Copper thickness: 1 oz Surface finish: ENIG Solder mask & Silkscreen: Green & White Min. line space: 4 mil Min. line width: 4 mil ...
6L Printed Circuit Board Layer:6L Material: FR4 TG170 Thickness:1.6mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.25mm Surface Finish: ENIG Finish Copper:35/35μm ...
4L Printed Circuit Board, yellow soldermask Layer:4L Material: FR4 Thickness:1.6mm Min Width/Space: 0.075mm/0.075mm Finish Hole: 0.25mm Surface Finish: ENIG Finish Copper:35/35μm Solder mask: Yellow ...
Place of Origin: SZ,GD,China Manufacturer: Rigao Electronics Services Code: RG-002 Product Name: HDI Multilayer High Density PCB and Rigid Circuit Board Board material: FR4 Board thickness: 1.2mm PCB Layers: 12 layers Copper thickness: 1oz Surface finishing: ENIG Solder mask: ...
Place of Origin:Guangdong China (Mainland) Material Mixed Laminate:12layers,FR4+Ro4350,FR4+Aluminium,FR4+FPC ...
Layer Count:4 layers Certificate:RoHS,UL,ISO9001:2000 Surface Finishing:gold plating Min. Line Spacing:0.2mm Min. Line Width:0.2mm Min. Hole Size:0.3mm Board Thickness:1.6mm Copper Thickness:1oz Base Material:FR4 94v0 Brand Name:ZBX Place of Origin:Guangdong China (Mainland) ...
Certification:ROHS, ISO9000 Surface Finishing:HASL, OSP, ENIG, Imm Gold Min. Line Spacing:0.15mm Min. Line Width:0.15mm Min. Hole Size:0.2mm Board Thickness:0.2~2.4mm Copper Thickness:0.5~3.0oz Base Material:FR-4 Brand Name:OEM Place of Origin:Guangdong China (Mainland) ...