Number of layers: 4 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 6/3.5mil Inner layer W/S: 6/4mil Thickness: 0.8mm Min. hole diameter: 0.28mm Special process: impedance control+half hole Advantages Of 4 Layer ENIG Impedance Control Half Hole Fr4 PCB Own lamination ...
Number of layers: 2 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Thickness: 1.0mm Min. hole diameter: 0.3mm Special process: impedance control+half hole Advantages Of 2 Layer ENIG Impedance Control Half Hole PCB Product Own lamination process to convenient ...
Number of layers: 8 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/3.5mil Inner layer W/S: 4/3.5mil Thickness: 1.2mm Min. hole diameter: 0.2mm Special process: impedance control+half hole Advantages Of 8 Layer ENIG Impedance Control Half Hole PCB Own lamination ...