| Type: | 1A1R |
| Bond: | Resin or Metal |
| Application: | Glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN(copper epoxy molding ), splitter, sapphire |
| Specification: | Customized |
| Brand Mark: | Moresuperhard |
| Trade Terms: | FOB |
| Packages: | Hard carton |
| Delivery Time: | 15 workdays by express |
Diamond dicing blade is sintered from a combination of diamond powders and bonds. It comes with excellent form holding characteristics, and an extremely high wear resistance, is used for cutting and slotting of electronic and optical components.
| D(mm) | T(mm) | U(mm) | H(mm) | X(mm) |
| 4” /100 | 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 | 0.4, 0.5, 0.6, 0.8, 1.0, 1.3. | 20, 31.75 | 5, 10 |
| 5”/ 125 | 0.5, 0.6, 0.8, 1.0, 1.2, 1.5 | 0.4, 0.5, 0.6, 0.8, 1.0, 1.3 | 20, 31.75 | 5, 10 |
| 6”/ 150 | 0.6, 0.8, 1.0, 1.2, 1.5, 1.8 | 0.5, 0.6, 0.8, 1.0, 1.3, 1.6 | 20, 31.75 | 5, 7, 10 |
| 8”/ 200 | 0.8, 1.0, 1.2, 1.5, 1.8 | 0.6, 0.7, 0.8, 0.9, 1.1, 1.2, 1.4, 1.5. | 20, 31.75 | 5, 7, 10 |
| 12”/ 300 | 1.0, 1.2, 1.4, 1.5, 1.7, 1.8 | 0.7, 0.9, 1.1, 1.4 | 20, 31.75 | 5, 7, 10 |
| 16”/ 400 | 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 | 0.9, 1.2, 1.4, 1.6, 2.0 | 20, 31.75 | 5, 7, 10 |
| 20”/ 500 | 1.2, 1.5, 1.7, 1.8, 1.9, 2.0, 2.3 | 0.9, 1.2, 1.4, 1.6, 2.0 | 20, 31.75 | 5, 7, 10 |
| Other size can be made according to customers’ requirement |
Detailed Specifications can be customized!
– Excellent cutting ability that help reduce chipping, fractures and achieve smooth surface finish
– Dicing hard and brittle materials. Such as QFN/MLF, Thick Ceramic Substrates and Glass, etc.
– Able to precisely control diamond concentration to achieve cutting quality
– Self sharpening matrix to expose new diamonds. Diamond grit size ranges from 3μm to 250μm depending on blade thickness