sn99.3cu0.7 Solder Ball
Product Quick Detail
- FOB Price
- USD $53,000.00 / Piece
- Place Of Origin
- china
- Minimum Order
- 1
- Packaging
- Standard export package or as required.
- Delivery
- 3-15 Days
Specifications
Product:Solder Ball
Product composition: tin 99.3 copper 0.7
Product size: 13mm 19mm 22mm
customizable
Product weight: can be customized
Solder ball is an indispensable and important material in new packaging. It is a new connection method that meets the requirements of electrical interconnection and mechanical interconnection. Due
to the rapid development of BGA and CSP in recent years, it has replaced the traditional pin package and lead frame package, thus playing an important role in electrical interconnection and
mechanical support in solder balls. BGA, CSP and other packaged devices connected by solder balls are widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. This
provides a broad application market and development prospects for solder ball products.
- Country:
- Business Type:
- Market:
- Founded Year:
- Address:
- Contact:daisy fan
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