Multilayer PCB Up to 64 Layers; FR4 TG135/TG150/TG170; Halogen Free/CTI≥600; Aspect Ratio (Finish Hole) 28:1; Sample Expedited 8 Hours(1-2Layer); HDI PCB Blind/Buried/Hybrid Via; 5+N(N+M)+5 Structure; Trace Width/Spacing 1.6/1.6mil; Laser Hole Size(mm)≥0.075; High Density ...
IC Substrate&Substrate-Like PCB CSP/FC-CSP/SIP/FC-BGA/WB-CSP FR4/BT/High-Speed Material Trace Width/Space 12/12μm SM Registration:±20μm Strict SM Flatness Control ≤5μm Founded in 2007,PEAK ...
Metal Core PCB Thermal Conductivity 1-398W/m.K Aluminum/Copper AC 500-4000V Post-bonding/Pre-bonding Sweat-Soldering/Conductive Adhesive Press-Fit/Embedded Coin(I, T U) Founded in 2007,PEAK ...
High Speed PCB Panasonic Megtron4/6/7 TU-872SLK/Isola-FR408HR,etc Impedance Tolerance ±5%(min) Dimension Accuracy ±0.02mm(min) Line Width/Space Accuracy ±5% Founded in 2007,PEAK ...
HDI PCB Blind/Buried Via 5+N(N+M)+5 Structure Trace Width/Spacing 1.6/1.6mil Laser Hole Size(mm)≥0.075 High Density Interconnector Founded in 2007,PEAK ...
Regular PCB Up to 64 Layers FR4 TG135/TG150/TG170 Halogen Free/CTI≥600 Aspect Ratio (Finish Hole) 28:1 Sample Expedited 8 Hours(1-2Layer) Founded in 2007,PEAK ...
Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buried Via PCB Own lamination process to convenient production for ...
Number of layers: 6 Surface finish: LF-HASL Base material: FR4 Outer Layer W/S: 11/6mil Inner layer W/S: 16/5mil Thickness: 1.6mm Min. hole diameter: 0.3mm Advantages Of 6 layer pcb Own lamination process to convenient production for Multilayer PCB and shorten the lead time. ...
Number of layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2mil Inner layer W/S: 4/3mil Thickness: 1.6mm Min. hole diameter: 0.15mm Advantages Of pcb 6 layer Own lamination process to convenient production for Multilayer PCB and shorten the lead time. ...
Number of layers: 6 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 4/2.5mil Inner layer W/S: 4.5/4.5mil Thickness: 1.0mm Min. hole diameter: 0.2mm Special process: impedance control Advantages Of 6 Layer ENIG Impedance Control PCB Bare Board Own lamination process to ...