High thermal conductivity, low expansion Ceramic PCB
Product sourcing details
- Place of Origin
- china
- FOB Price
- USD $99.00 / Piece
Supplier: Folysky Technology(Wuhan)Co.,Ltd
Purchasing information
- Minimum order
- 1
- Lead time
- 30 Days
Please confirm with the supplier: Model / reference, Key specifications / compatibility, Samples, Export markets, Supply capacity.
Specifications
Today ceramics are already widely used as substrates in many microelectronic components and power LED packages and more and more they are replacing entire printed circuit boards reducing
complexity in design and manufacturing while increasing performance. Examples are Chip-on-board (COB) modules, High power circuits, proximity sensors, battery drivers for EVs, - .
Ceramics advantages over other printed circuit boards:
Lower expansion coefficient
Good thermal properties
Superior high frequency performance
Lower system cost: reduces test, insertion, assembly
Smaller package size due to integration
Cost effective for dense package due to parallel processing of layers
Hermetic packages possible, 0% water absorption
Ceramics advantages over other printed circuit boards:
Lower expansion coefficient
Good thermal properties
Superior high frequency performance
Lower system cost: reduces test, insertion, assembly
Smaller package size due to integration
Cost effective for dense package due to parallel processing of layers
Hermetic packages possible, 0% water absorption
- Company: Folysky Technology(Wuhan)Co.,Ltd
- Contact: pengliang Tu
