The ZSH618 Dicing Saw Machine is our classic configuration model which has the advantages of compact structure, low cost with high performance, less area occupied.

The machine has mounted with LCD touch screen, man-machine operation interface; the image alignment of the work piece is simple and convenient to improve the operation convenience. The self design software is used in the control system to improve the cutting efficiency. The equipment has high reliability, low cost maintenance and stable performance

The additional functions allowing this ZSH618 to dicing material structures as quadrilateral, hexagon, polygon with varies depth and division,customization is also available.

Feature

Small size with compact structure;

Interactive man-machine operation interface

15” high resolution touch screen;

Easy operation, highly working efficiency;

Auto-aligning and auto focusing;

Safety and reliablemechanismto avoid misoperation.

Application

Semiconductor chip, LED, IC, NTC, PCB, quartz and sapphire, photovoltaic wafer, lithium niobate, ceramic, gallium arsenide, glass, etc.

Specification

Work size		Φ8”
Dicing depth		Max.4mm or customization
X-axis	Drive	Servo motor
Stroke(Working range)	Max. 370mm
Cutting speed	0.1 - 200mm/s
Y-axis	Drive	Stepper motor & raster
Stroke(Working range)	Max.210mm
Resolution	0.0005mm
Accuracy	0.003mm/5mm
Z-axis	Drive	Stepper motor
Stroke(Working range)	30mm
Resolution rate	0.001mm
Repeat accuracy	±0.001mm
θ-axis	Drive	Servo motor
Rotation range	360°* n
Resolution ratio	1.8″
Spindle	Power	1.5kw
Speed	3000～40000rpm
Panel	OS	Windows
Operation interface	English, Touch-screen
Microscope magnification	40× Auto Focus
Microscope light	LED
Working condition	Power supply	Single phase 220ACV；3kw
Compressed air	Pressure 0.55MPa, flow 200L/min
Cutting water	Pressure 0.2～0.4MPa, flow 3L/min
Spindle cooling water	Pressure 0.2～0.4MPa, flow 1.5L/min
	Dimension WDH	960mm×810mm×1710mm
	Weight	Approx.550KG